Signing of an agreement between Nanyang Polytechnic & 2 French institutes

French Ambassador to Singapore, Pierre Buhler, witnessed the signing of a Memorandum of Understanding on 3 April 2007 between world-renowned French animation and game institutions Supinfocom & Supinfogame and Nanyang Polytechnic (NYP) for collaboration in training and research in animation and games development. It is the first time a local educational institution taps on French flair in film, games design and animation.

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NYP and Supinfocom&Supinfogame

Through this collaboration, final-year students from NYP’s School of Interactive & Digital Media will spend three to six months at Supinfocom & Supinfogame, which are known for producing graduates with top-notch skills in film animation, game design and game production. During the attachment, the students will participate in projects related to their course of study. Similarly, students from Supinfocom & Supinfogame will be sent to NYP for engagement in final-year project work and related academic programmes.

With the overseas attachment exposure, NYP students will gain insights into international industrial trends, different training methodologies and exchange knowledge with their French counterparts in the areas of animation and games development. NYP and Supinfocom & Supinfogame are also currently in discussion on the provision of attachment opportunities and professional workshops for lecturers.

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For more information, visit :
- www.supinfocom.fr
- www.supinfogame.fr



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NYP and Groupe ESIEE

The signing of this MOU was held concurrently with a Memorandum of Understanding (MOU) between Nanyang Polytechnic (NYP) and French institution Groupe Ecole Superieure d’Ingenieurs en Electronique et Electrotechnique (Groupe ESIEE), to collaborate on technology development and applied research in various emerging fields.

The agreement will also see the two institutions further collaborate on project research & development, staff and student exchange, and pedagogical programmes involving mutual credit recognition for completion of academic coursework.

Through the MOU, both institutions will continue to collaborate on technology and project development, and build capabilities in areas such as MEMS & nanotechnology, alternative energy, wireless technology, IC design, embedded technology, and also in new areas such as business informatics.

For more information, visit www.esiee.fr/en

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Dernière modification : 31/07/2007

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